n explanation of part numbers n features l encased in ceramic package l high reliability against soldering heat and mechanical stress l moisture-proof sealing l low profile type (1.8 mm maximum in thickness) l designed for reflow soldering l flat-bottom plate for better mountings n precautions for safety (see page 218 to 219) n recommended applications l clock generator for microprocessers l carrier between telecommunication equipment (telephone to telephone, personal computer to printer) n ratings and characteristics note: also available are types other than above standard products in the frequency range of 3 to 50.0 mhz. please contact us for more information. n application notes l soldering conditions reflow soldering shall be done at 220 ?c for less than 10 seconds, and peak temperature of 240 ?c. (remark) flow soldering method and dip soldering method shall not be applied. ceramic resonators, chip type (thin type) type: ps (4 to 8 mhz) type: pm (4 to 13 mhz) type: dm (12 to 20 mhz) type: lm 16.0 to 20.0 mhz ( ) 30.1 to 50.0 mhz e f o 4004 part number oscillation loop gain temperature frequency bulk pack embossed taping (g) characteristics (fo) efops4004b5 efops4004e5 4.00 mhz 0.5 % 10 db min. maximum frequency drift: efops8004b5 efops8004e5 8.00 mhz 0.5 % 1.0 %, e20 to 80 ?c efopm4004b5 efopm4004e5 4.00 mhz 0.5 % 10 db min. maximum frequency drift: efopm8004b5 efopm8004e5 8.00 mhz 0.5 % 0.3 %, e20 to 80 ?c efopm1005b5 efopm1005e5 10.00 mhz 0.5 % 15 db min. maximum frequency drift: efopm1205b5 efopm1205e5 12.00 mhz 0.5 % 1.0 %, e20 to 80 ?c efodm1205b5 efodm1205e5 12.00 mhz 0.5 % 15 db min. maximum frequency drift: efodm2005b5 efodm2005e5 20.00 mhz 0.5 % 1.0 %, e20 to 80 ?c efolm1605b5 efolm1605e5 16.00 mhz 0.5 % maximum frequency drift: efolm1695b5 efolm1695e5 16.93 mhz 0.5 % 15 db min. 1.0 %, e20 to 80 ?c efolm2005b5 efolm2005e5 20.00 mhz 0.5 % efolm3205b5 efolm3205e5 32.00 mhz 0.5 % maximum frequency drift: EFOLM3385B5 efolm3385e5 33.868 mhz 0.5 % 6 db min. 0.3 %, e20 to 80 ?c efolm4005b5 efolm4005e5 40.00 mhz 0.5 % ceramic resonators (chip type) l operating temperature range: e20 to 80 ?c
n dimensions in mm (not to scale) l bulk [type ps] efops 1111 b 1 l embossed taping efops 1111 e 1 [type lm] efolm 1111 b 1 ceramic resonators (chip type) [type dm] efodm 1111 b 1 [type pm] efopm 1111 b 1 dim. a b w f e p 1 (mm) 2.60.2 5.10.2 12.00.3 5.50.1 1.750.10 4.00.1 efolm 1111 e 1 dim. p 2 p 0 f d 0 t 1 t 2 (mm) 2.00.1 4.00.1 1.5 0.6 max. 3.0 max . +0.1 0 dim. a b w f e p 1 (mm) 4.10.2 4.90.2 12.00.3 5.50.1 1.750.10 8.00.1 dim. p 2 p 0 f d 0 t 1 t 2 (mm) 2.00.1 4.00.1 1.5 0.6 max . 3.0 max . +0.1 0 dim. a b w f e p 1 (mm) 3.70.2 8.30.2 16.00.3 7.50.1 1.750.10 8.00.1 efopm 1111 e 1 dim. p 2 p 0 f d 0 t 1 t 2 (mm) 2.00.1 4.00.1 1.5 0.3 3.5 max . +0.1 0 efodm 1111 e 1 dim. p 2 p 0 f d 0 t 1 t 2 (mm) 2.00.1 4.00.1 1.5 0.6 max. 3.0 max . +0.1 0 dim. a b w f e p 1 (mm) 3.40.2 4.60.2 12.00.3 5.50.1 1.750.10 8.00.1
n typical characteristics n recommended land dimensions n packaging specifications supplied in bulk or taped & reel packing style l standard packing quantity type embossed taping bulk pm 2500 pcs./reel 500 pcs./bag ps 2000 pcs./reel 500 pcs./bag lm, dm 1000 pcs./reel 500 pcs./bag l dimensions for reel in mm (not to scale) [type pm] [type lm, ps, dm] (type pm/lm) ceramic resonators (chip type) (mm) type pm type lm a 2.5 1.6 b 0.9 to 1.2 0.7 to 1.0 c 3.8 to 4.7 4.2 to 5.1 dim. f a f bc d e (mm) 3305 80 min. 13.00.5 21.00.8 2.00.5 dim. w t t r (mm) 16.4 22.4 max. 3 max. 1.0 +2.0 0 dim. f a f bc d e (mm) 1805 60 min. 13.00.5 21.00.8 2.00.5 dim. w t t r (mm) 12.4 18.4 max. 3 max. 1.0 +2.0 0 n test circuits diagram frequency ic 3.00 to 8.38 mhz pd 4069ubc 8.4 to 13.0 mhz 16.0 to 20.0 mhz pd 74hcu04 30.1 to 50.0 mhz type ss type bm a 3.0 1.35 b 0.55 0.8 c 0.8 ? d 2.6 3.9 e 1.6 ? (mm) l type efops l type efodm
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